|THP042||Initial Results from Investigations into Different Surface Peparation Techniques of OFHC Copper for SRF Applications||941|
Funding: This work forms part of the EASITrain research programme. This Marie Sklodowska-Curie Action (MSCA) Innovative Training Networks (ITN) has received funding from the European Union’s H2020 Framework Programme under Grant Agreement no. 764879
As part of efforts to improve the performance of thin film coated accelerating cavities, improvement of the topography of the surface of copper is being pursued. This is known to strongly affect the properties of the deposited superconducting thin film. This study focuses on determining the optimal procedure to enhance homogeneity and smoothness of the copper surface. OFHC copper substrates have been processed using mechanical polishing (MP), chemical polishing (CP) and electropolishing (EP) procedures as well as a combina-tion thereof. The parameters of each of the procedures have been tested and optimised to produce the smoothest surface possible. The resulting samples have been analysed using a scanning electron microscope, a laser profilometer and a confocal microscope. Results indicate the superior per-formance of electrochemical polishing over chemical polishing in terms of planarization efficiency, while a combination of mechanical polishing followed by electropolishing provides the most homogeneous and smooth surface when utilising the critical current density of the electrolyte.
|Poster THP042 [1.190 MB]|
|DOI •||reference for this paper ※ https://doi.org/10.18429/JACoW-SRF2019-THP042|
|About •||paper received ※ 22 June 2019 paper accepted ※ 29 June 2019 issue date ※ 14 August 2019|
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