Author: Hu, H.
Paper Title Page
MOP013 Reducing Surface Roughness of Nb3Sn Through Chemical Polishing Treatments 48
  • H. Hu, M. Liepe, R.D. Porter
    Cornell University (CLASSE), Cornell Laboratory for Accelerator-Based Sciences and Education, Ithaca, New York, USA
  Niobium-3 tin (Nb3Sn) is a promising alternative material for SRF cavities, with theoretical limits for critical temperatures and superheating fields reaching twice that of conventional Nb cavities. However, currently achievable accelerating gradients in Nb3Sn cavities are much lower than their theoretical limit. One limitation to the maximum accelerating gradient is surface magnetic field enhancement caused by the surface roughness of Nb3Sn. However, there are currently no standard techniques used to reduce Nb3Sn surface roughness. Since Nb3Sn is only 2-3 microns thick, it is difficult to selectively polish Nb3Sn without removing the entire layer. Here, we investigate reducing the surface roughness of Nb3Sn through applying chemical polishing treatments, including modified versions of standard techniques such as Buffered Chemical Polishing (BCP) and Electropolishing (EP). Through data acquired from Atomic Force Microscope (AFM) scans, SEM scans, and SEM-EDS analysis, we show the effects of these chemical treatments in reducing surface roughness and consider the changes in the chemical composition of Nb3Sn that may occur through the etching process. We find that BCP with a 1:1:8 solution is ineffective while EP halves the surface roughness of Nb3Sn.  
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About • paper received ※ 01 July 2019       paper accepted ※ 04 July 2019       issue date ※ 14 August 2019  
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